Renesas Launches Industry’s Smallest GreenPAK Mixed Signal Devices for Wearable and Portable Electronics

• The industry’s smallest WLCSP-packaged GreenPAK device, featuring a 9-ball, 1.155 mm × 1.155 mm, with an STQFN option for additional I/O and package flexibility
• Multi-time programmable and target I²C enable in-system bug fixes, updates and configuration changes after deployment
• Full 1.71 V to 5.5 V operating and configurable range supports versatile, low-cost sensing, control and glue-logic functions

TOKYO, Japan, September 24, 2026   ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the SLG46801, the industry’s smallest GreenPAK configurable mixed-signal device offered in both WLCSP and STQFN packages. The 9-ball WLCSP measures just 1.155 mm × 1.155 mm and combines an ultra-small footprint with multi-time programmability to enable designers to reduce board space in compact products such as smart rings, smartwatches, fitness bands, VR glasses and portable electronics.

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As consumer devices become smaller and feature rich, designers need to integrate additional functionality while reducing component count, PCB area and bill-of-materials cost. The SLG46801 addresses these requirements by combining commonly used analog, timing and logic functions in a compact, low-power device that can complement an MCU or replace multiple discrete components.

“Designers are being asked to integrate more functionality into increasingly compact products without increasing system cost or development effort, while also reducing power consumption.” said Jason Kim, Vice President and General Manager of the Core Analog Division at Renesas. “The SLG46801 expands our GreenPAK portfolio with an ultra-compact WLCSP option and flexible in-system configurability, helping customers create smaller, more feature-rich products and implement updates even after deployment.”

The SLG46801 integrates two high-speed analog comparators, configurable lookup tables, counters and delays, 10 kHz and 25 MHz oscillators, voltage-tolerant GPIOs and an I²C-compatible serial interface. These resources support sensing, control, glue-logic, timing and system housekeeping functions in applications across consumer electronics, handheld devices, smart-home systems, networking and communications, computing and storage, industrial control and IoT sensor nodes.

In addition to the 9-ball WLCSP, the SLG46801 is available in a 12-lead, 1.6 mm × 1.6 mm × 0.55 mm STQFN package. The two package options allow customers to balance minimum board area with additional GPIO availability and industrial package preferences. The device also offers one of the lowest cost per GPIO in the GreenPAK family.

Renesas is a leader in configurable mixed-signal technology, with more than four billion GreenPAK devices shipped worldwide. GreenPAK ICs enable designers to combine analog and digital system functions in small, low-power devices that can be configured using the Renesas Go Configure™ Software Hub. The free GUI-based development environment helps customers develop custom hardware functions without the need for additional discrete components or complex firmware development.

The SLG46801 includes multi-time programmable non-volatile memory that can be configured in system through its I²C interface. This allows customers to implement bug fixes, configuration changes and product upgrades after the device has been integrated into the end application, helping reduce redesign cycles and additional hardware revisions.

The device supports operation and programming across the full 1.71 V to 5.5 V supply range—the widest operating and configurable range among MTP GreenPAK devices. GPIO pins can also be repurposed dynamically for the I²C interface, maximizing flexibility in designs with limited pin availability. Optional CRC-8 and read-back protection support more robust and controlled configurable implementations.

Availability

The SLG46801 in the STQFN package is sampling now, with the WLCSP package available at mass production planned for November 2026. Renesas Go Configure Software Hub is available for programing, emulation and simulation. More information is available at https://www.renesas.com/products/slg46801