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AI & Data Center

DigiKey Sponsors electronica India Tech Challenge 2026

Power Management

TDK launches non-isolated 12.5 kW three-phase power supplies for Distributed Power Architectures

Semiconductor News

Vishay Intertechnology XClampR® Bidirectional Flat Clamping TVS in DO-218AC Package Deliver Low Clamping Voltage, High Power Density

Design & Manufacturing

MacDermid Alpha Addresses Growing Demands for Electronics Reliability and Manufacturing Performance at Productronica India 2026

Renesas Launches New MCUs for Human Machine Interface and IoT Edge Systems

DigiKey Sponsors electronica India Tech Challenge 2026

TDK launches non-isolated 12.5 kW three-phase power supplies for Distributed Power Architectures

Vishay Intertechnology XClampR® Bidirectional Flat Clamping TVS in DO-218AC Package Deliver Low Clamping Voltage, High Power Density

MacDermid Alpha Addresses Growing Demands for Electronics Reliability and Manufacturing Performance at Productronica India 2026

Renesas Launches New MCUs for Human Machine Interface and IoT Edge Systems

Latest News

DigiKey Sponsors electronica India Tech Challenge 2026

AI & Data Center

DigiKey Sponsors electronica India Tech Challenge 2026

September 11, 2026

TDK launches non-isolated 12.5 kW three-phase power supplies for Distributed Power Architectures

Power Management

TDK launches non-isolated 12.5 kW three-phase power supplies for Distributed Power Architectures

September 10, 2026

Vishay Intertechnology XClampR® Bidirectional Flat Clamping TVS in DO-218AC Package Deliver Low Clamping Voltage, High Power Density

Semiconductor News

Vishay Intertechnology XClampR® Bidirectional Flat Clamping TVS in DO-218AC Package Deliver Low Clamping Voltage, High Power Density

September 10, 2026

Design & Manufacturing

MacDermid Alpha Addresses Growing Demands for Electronics Reliability and Manufacturing Performance at Productronica India 2026

September 10, 2026

Renesas Launches New MCUs for Human Machine Interface and IoT Edge Systems

Robotics

Renesas Launches New MCUs for Human Machine Interface and IoT Edge Systems

September 10, 2026

Renesas to Showcase Technologies Driving Future of AI — Software-Defined Vehicle and Intelligence at the Edge — at electronica India 202

Automotive

Renesas to Showcase Technologies Driving Future of AI — Software-Defined Vehicle and Intelligence at the Edge — at electronica India 202

September 10, 2026

Harwin Strengthens High-Reliability Offering with Acquisition of KEC

Aerospace and Defence

Harwin Strengthens High-Reliability Offering with Acquisition of KEC

September 10, 2026

VIAVI to Showcase Data Center Testing Portfolio at ECOC 2026

AI & Data Center

VIAVI to Showcase Data Center Testing Portfolio at ECOC 2026

September 10, 2026

Latest Review

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Business

DigiKey Sponsors electronica India Tech Challenge 2026

DigiKey Sponsors electronica India Tech Challenge 2026

September 11, 2026

TDK launches non-isolated 12.5 kW three-phase power supplies for Distributed Power Architectures

Vishay Intertechnology XClampR® Bidirectional Flat Clamping TVS in DO-218AC Package Deliver Low Clamping Voltage, High Power Density

MacDermid Alpha Addresses Growing Demands for Electronics Reliability and Manufacturing Performance at Productronica India 2026

Politics

Renesas Launches New MCUs for Human Machine Interface and IoT Edge Systems

Renesas Launches New MCUs for Human Machine Interface and IoT Edge Systems

September 10, 2026

Renesas to Showcase Technologies Driving Future of AI — Software-Defined Vehicle and Intelligence at the Edge — at electronica India 202

Harwin Strengthens High-Reliability Offering with Acquisition of KEC

VIAVI to Showcase Data Center Testing Portfolio at ECOC 2026

Tech

Analog Devices to Acquire Alif Semiconductor

Analog Devices to Acquire Alif Semiconductor

September 10, 2026

Infineon extends collaboration with SolarEdge to enable solid-state protection for 800 VDC AI data centers

Microchip’s 1.2V Clock Buffers Link Latest SoCs and FPGAs with Higher Voltage Components

Arrow Electronics enables early evaluation of NXP’s Ara240 Edge AI Accelerator

Entertainment

Avnet Silica to Showcase Intelligent, Connected Systems from Device to Cloud at SIDO 2026

September 9, 2026

Physical AI Will Transform Robotics into Scalable Intelligent Machines: Allan Lagasca, STMicroelectronics

Expanded Line-up of Automotive-Grade Metal Power Inductors

ST25DA-C, 1st fully compliant Matter 1.6 device already at the center of NFC commissioning for many industry giants

Lifestyle

Vishay Intertechnology 45 mm Inductive Position Sensor Encoder Enables Reliable Operation Near Electric Motors

Vishay Intertechnology 45 mm Inductive Position Sensor Encoder Enables Reliable Operation Near Electric Motors

September 9, 2026

TDK launches industry-leading low-resistance soft-termination X7R MLCCs with 10 μF/100 V in the 3225 format for AI servers, humanoids, and xEVs

Fujitsu develops diamond-spin quantum computer prototype

Crealights and GlobalFoundries Deepen Global Strategic Partnership

Science

New Infineon OPTIREG™ TLE9744QK Power Management IC integrates power and safety for hybrid and electric vehicle traction inverters

New Infineon OPTIREG™ TLE9744QK Power Management IC integrates power and safety for hybrid and electric vehicle traction inverters

September 8, 2026

SolarSense AI: Predictive Solar Panel Cleaning with ESP32

Industry Stalwarts Rally Behind WOWSemi to Build India’s Semiconductor Talent Ecosystem

MEMS Sensors Must Survive Both Shock and Vibration

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