Driving the transition in product packaging by investing in capacity and portfolio Nijmegen, May 16, 2022: Nexperia, the expert in...

New UK facility being built to deliver lightweight, convenient and space-saving flexible printed circuit technology in high volume to EV...

Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and...

Higher frequency AC/DC controllers and drivers improve industrial design while ensuring optimal efficiency across the load range PHOENIX – May...

To integrate silicon-carbide power technology in next-generation electric-vehicle drives Long-term engineering and component-supply cooperation with ST contributes to success as...

MAYA-W2 is among the first host-based modules to extend the benefits of highly efficient Wi-Fi 6 to industrial applications. Thalwil,...

Plano, Texas – May 11, 2022 – Diodes Incorporated (Diodes) (Nasdaq: DIOD) has introduced the automotive-compliant DIODES™ AP61300Q and DIODES™...

Latest silicon carbide (SiC)-based VE-Trac modules provide next-generation electric vehicles with longer range, higher efficiency and faster acceleration PHOENIX –...

Automotive-Qualified IGBT/SiC Module Driver Family; Targets Bus, Truck and Con-Ag EVs Compact driver board features reinforced isolation, ASIL B/C certification...

With the MediaTek Genio platform stack, designers and OEMs can bring differentiated and secure intelligent devices to market faster Scottsdale,...