HKUST/UCSB team demonstrates record 1.3μm CW submilliamp-threshold quantum dot micro-lasers on silicon
With the increasing need for miniaturization and large-scale integration of photonic components on a silicon platform for datacoms and emerging...
GlobalFoundries launches 8SW RF SOI process for next-gen mobile and 5G applications
GlobalFoundries of Santa Clara, CA, USA (one of the world’s largest semiconductor foundries, with more than 250 customers and operations...
glō orders Aixtron G5+ 8x150mm MOCVD system for micro-LED production
Deposition equipment maker Aixtron SE of Herzogenrath, Germany has received an order for an AIX G5+ metal-organic chemical vapor deposition...
QSFP-DD MSA Group releases 3.0 Hardware specification
The Quad Small Form Factor Pluggable Double Density (QSFP-DD) Multi Source Agreement (MSA) group has released an updated 3.0 Hardware...
SDK expanding high-grade SiC epi production capacity from 3000 to 5000 wafers per month
Tokyo-based Showa Denko K.K. (SDK) has decided to expand its facilities for producing high-quality-grade silicon carbide (SiC) epitaxial wafers for...
IQE extends production of VCSEL epiwafers with Aixtron AIX 2800G4-TM MOCVD systems
Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany has received an order for multiple metal-organic chemical vapor deposition...
NCSU rolls out PRESiCE manufacturing process to open up SiC power device market to more companies
North Carolina State University (NCSU) is rolling out a new manufacturing process and chip design for silicon carbide (SiC) power...
Norstel completes 150mm SiC n-type wafer development
Norstel AB of Norrköping, Sweden has developed low-defect-density 150mm silicon carbide (SiC) n-type substrates. Norstel manufactures conductive (n-type) and semi-insulating...
100G Lambda MSA to define specification for next-generation optical links
The 100G Lambda Multi-Source Agreement (MSA) Group has announced their intent to develop specifications based on 100Gbps per wavelength optical...
Evatec expanding Greater China operations to support rapid business growth
Evatec Ltd of Trübbach, Switzerland (which makes thin-film deposition and etch processing equipment for advanced packaging, power device, MEMS, optoelectronics,...
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