The 26th China International Industry Fair (CIIF 2026), Asia’s premier industrial trade event, is officially scheduled to take place from...

Innovative multiaxial sensing architecture achieves 20 times greater accuracy than single-axis, coreless alternatives, driving more compact and efficient traction inverter...

Munich, Germany – 26 August 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) supplies silicon carbide (SiC) power...

Five-year agreement expands relationship across Group Engineering Services Framework Bangalore, India, 26th August 2026 — Quest Global Engineering Services Limited, one of...

Nijmegen / Taipei, 26 August 2026 — Trymax Semiconductor Equipment (“Trymax”), a specialist manufacturer of plasma- and UV-based solutions for the semiconductor and optoelectronics...

The proposed acquisition is expected to provide the last step in power delivery to the core to complete Navitas’ grid-to-xPU...

Tessenderlo-Ham, Belgium, 25 August 2026 – Melexis, a global microelectronics engineering company, signed a Master Purchase Agreement (MPA) with BYD,...

Acquisition strengthens Infineon’s leadership in power solutions for AI data centers and accelerates software-defined power architectures from grid to core ...

HELIX joint R&D initiative to enable new generative and embodied AI use cases at the edge through system-to-silicon innovation Research...

OpenLight's InP-on-silicon platform enables fully integrated photonic chips that reduce power consumption, footprint, cost and system complexity. Santa Clara, Calif.,...