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Avnet Silica to Bring Production-Ready Edge AI, Robotics, and Embedded Innovation to Hardware Pioneers Max 2026

Semiconductor For You by Semiconductor For You
June 9, 2026
in Semiconductor News
0

Live demonstrations will show how embedded compute, sensing, connectivity, and artificial intelligence are coming together to help engineers power the next generation of edge applications

Brussels, Belgium, 09 June 2026 – Avnet Silica, an Avnet company (NASDAQ: AVT), today announced details of its participation in Hardware Pioneers Max 2026, taking place from 10-11 June 2026 at ExCeL London.

At stand H2, Avnet Silica will give visitors the opportunity to explore live demonstrations powering next-generation embedded, edge and AI-enabled design. From vision applications and robotics to cellular connectivity and high-performance human-machine interfaces (HMIs), the demonstrations will feature solutions developed with leading technology partners, including AMD, DEEPX, Microsoft, Nordic Semiconductor, onsemi, Renesas, and Tria.

Avnet Silica technical specialists will also be available throughout the event to discuss real-world design challenges, from selecting the right compute and connectivity architecture to reducing power, development costs, and complexity in production-ready edge systems.

Key Demonstrations Will Include:

  • Sensing & Robotics: onsemi’s Sensor-Controlled AMR demonstration will show how autonomous mobile robot (AMR) platforms can combine force, position, ultrasonic, and vision sensing with power, Ethernet, and three-phase brushless direct current (BLDC) motor solutions.
  • Embedded Graphics & HMI: This Tria solution demonstrates high-performance industrial visualisation using NXP i.MX95 and a Mali GPU, enabling real-time graphics and responsive user interfaces within embedded power constraints.
  • Vision AI Acceleration: Showing the power of dedicated hardware tuned for AI-based camera workloads, Renesas and DEEPX will present a hybrid acceleration demonstration with optimised workload distribution across dynamic reconfigurable processor (DRP) and neural processing unit (NPU) architectures.
  • Industrial Edge AI: Experience AI at the Edge on industrial hardware components from leading partners in a combined demo from AMD, DEEPX and Microsoft’s Windows 11 IoT Enterprise 2024 LTSC. The DEEPX DX‑M1 M.2 LPDDR5x2 AI Accelerator enables offline AI on hardware without native AI capability, while Microsoft’s Local Foundry provides long‑term support, strong security, and standardisation across AMD & Intel x86 and Arm platforms
  • Wireless & Embedded: Nordic Semiconductor will showcase LTE Cat 1bis with Thales SGP.32 eSIM, enabling low-power, globally deployable IoT connectivity with support for multiple bands, positioning methods and simplified integration across regions.
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