SoftBank Corp. and Fujitsu Strengthen Partnership for Realization of AI-RAN Commercialization
SoftBank Corp. (Note 1) ("SoftBank") and Fujitsu Limited (Note 2) ("Fujitsu") signed a memorandum of understanding on October 25, 2024,...
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Murata Expands Combined Gyro and Accelerometer 6DoF Sensor Family with Revolutionary Automotive Solution
Hoofddorp, Netherlands: Murata is expanding its range of innovative Six Degrees-of-Freedom devices with the introduction of the SCH1633-D01. The micro-electromechanical system...
Renesas Introduces New AnalogPAK Programmable Mixed-Signal ICs
Devices Reduce Component Count, BOM Cost and Board Space in Almost Any Application TOKYO, Japan, November 12, 2024 ― Renesas...
Nexperia’s new 120 V/4 A half-bridge gate driver raises robustness and efficiency in automotive applications
Increasing power converter efficiency while also delivering smoother motor control Nijmegen, November 12, 2024: Nexperia today introduced a new series...
Release of updated OSM Specification 1.2 and new Design Guide 1.1
Munich, 11. November 2024 – The Standardization Group for Embedded Technologies (SGET) is excited to announce the official release of OSM...
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