SEGGER’s new Embedded Studio: One IDE for both Arm and RISC-V
Monheim am Rhein, Germany – January 10h, 2024 SEGGER is excited to announce the new Embedded Studio - V8.10. This...
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Infineon strengthens multi-sourcing strategy in new supplier agreement with SK Siltron CSS for silicon carbide wafers
Munich, Germany – 10 January 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global leader in semiconductor...
OMNIVISION Announces First 3MP SoC Image Sensor for LED Flicker-Free, High Dynamic Range Automotive Cameras
SANTA CLARA, Calif. – January 9, 2024 – OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging,...
New LCD bias power ICs from Nexperia deliver high performance in display devices
Extends battery life and video display lifetime in smartphones and VR headsets Nijmegen, January 09, 2024: Nexperia today introduced a...
TI debuts new automotive chips at CES 2024
News highlights: The industry’s first single-chip radar sensor designed for satellite architectures can increase vehicle sensing ranges beyond 200 meters...
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