Nidec and Renesas Collaborate on Semiconductor Solutions for Next-Generation E-Axle for EVs
June 5, 2023 ― Nidec Corporation (TSE: 6594; OTC US: NJDCY) and Renesas Electronics Corporation (TSE:6723) have agreed to join...
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Dolphin Design Selects Imperas for Processor Functional Design Verification
ImperasDV processor verification solutions enable 'step-compare' advanced functional verification including asynchronous events, plus verification IP reusability with RVVI Close up...
u-blox and Tallysman Wireless, a Calian Company, Announce PointPerfect Augmented Smart GNSS Antenna/Receivers
Combines u-blox ZED-F9R / NEO-D9S high-precision GNSS modules with Tallysman’s Accutenna Technology and XF filtering Thalwil, Switzerland, and Ottawa, Canada...
Vitesco Technologies and onsemi sign SiC long-term supply agreement
Vitesco Technologies is securing silicon carbide (SiC) supply capacity worth $1.9 billion (€1.75 billion) Vitesco Technologies is gaining access to...
OMNIVISION Announces First Fully Integrated, Low-Power, Single-Chip LCOS Panel for Next-Generation AR/XR/MR Glasses
The new OP03011 LCOS panel integrates the array and frame buffer into an ultra-compact single-chip solution that is lightweight and...
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