Nexperia brings the benefits of clip-bonded FlatPower packaging to bipolar junction transistors
CFP15B package offers a compact and cost-efficient alternative to MJD series in DPAK package Nijmegen, July 16, 2025: Nexperia today...
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TDK announces launch of TDK SensEI’s edgeRX Vision
TDK has unveiled the latest TDK SensEI product line, edgeRX Vision, an ultra-fast, AI-powered defect detection system that analyzes customer...
Power Integrations Names Jennifer Lloyd as Its Next CEO
Analog industry veteran to succeed longtime leader Balu Balakrishnan SAN JOSÉ, CALIF. – July 15, 2025 – Power Integrations (Nasdaq: POWI), the...
New trade show to promote innovation in UK microelectronics, embedded systems and optoelectronics engineering
· Microelectronics UK exhibition to open at Excel London on 24-25 September 2025 with keynote speech from UK government innovation...
Aerial-Ground Surveillance Robot Using Arduino and Quadcopter Integration
This project presents a hybrid surveillance system that combines a two-wheel drive (2WD) land vehicle with a quadcopter drone for...
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