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Renesas Launches Industry’s First Dual-side-cooled 650V GaN Device for AI Data Centers

Renesas Launches Industry’s First Dual-side-cooled 650V GaN Device for AI Data Centers

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into space-constrained megawatt-scale racks. One of the lowest on resistances in the 650V class, at 20 mΩ in an 8x8 mm package. Single-source path to 800V designs with industry-standard PQFN footprint plus full controller, driver and MCU...

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