Renesas and LUPA Accelerate Automotive Smart Camera Development with Open Platform Turnkey Solutions
Jointly-Developed Open Camera Platform Significantly Shortens Time to Mass Production of Euro NCAP, C-NCAP, and L2+ Applications TOKYO, Japan and...
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Anritsu in collaboration with Qualcomm verifies industry first EPS-FB test for 5G New Radio
Anritsu Corporation is pleased to announce that the first EPS-FB Protocol Conformance test for 5G NR has been verified on...
Qualcomm Advances AR
Qualcomm Technologies, Inc. introduces its first augmented reality (AR) reference design based on the Qualcomm® Snapdragon™ XR1 Platform, equipped to...
Nexperia extends LFPAK56D MOSFET line-up with AEC-Q101-qualified half-bridge package
Space-saving LFPAK56D half-bridge offers 60 % lower parasitic inductance and improved thermal performance for power train, motor control and DC/DC...
6-DoF XYZ-axis MEMS-based inertial sensor from Murata
Hoofddorp, Netherlands: Murata announces the introduction of a 6-DoF (Degrees of Freedom) MEMS-based XYZ-axis inertial sensor for high-precision machine control...
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