HARMAN Embedded Audio Showcases Connected Device Innovation at Mobile World Congress 2026
BARCELONA — Feb. 24, 2026 — HARMAN Embedded Audio (HEA), a leading end‑to‑end B2B embedded audio solutions provider, announced it will showcase...
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Teledyne FLIR OEM Launches Lepton XDS at Mobile World Congress; A Compact Thermal‑Visible Camera Module Featuring Patented MSX Technology
Prism™ ISP–Powered Dual Camera Module Delivers Enhanced Performance and Faster Integration for OEMs BARCELONA and GOLETA, Calif.,– Teledyne FLIR OEM, a...
VIAVI announces DCX 700 tier 1 optical loss test set for testing up to 24 fibers
Bangalore - February 25, 2026 – VIAVI Solutions has announced the DCX 700 tier 1 optical loss test set for testing up to...
Rohde & Schwarz advances AI-RAN testing using digital twins with NVIDIA
Rohde & Schwarz, in collaboration with NVIDIA, continues to drive AI-RAN innovation for 5G-Advanced and 6G. The latest testbed to...
Renesas R-Car V4H ADAS SoC Selected for Toyota RAV4 Model
Renesas ADAS automotive SoC, R-Car V4H has been selected for the TSS(LSS) control unit supplied by Denso for Toyota’s new...
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