SGET Shakes Up FPGA Market with World Premiere of oHFM
The Open Harmonized FPGA Module Standard Munich, Germany – January 8, 2026 – The Standardization Group for Embedded Technologies e.V....
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TSA awards Rohde & Schwarz contract for advanced airport screening ahead of Soccer World Cup 2026
The Transportation Security Administration (TSA) is deploying Rohde & Schwarz QPS201 security scanners with advanced imaging technology (AIT) at airport...
Steel-Based Resistors That Outperform Ceramic in High-Power Designs
By Barley Li, Applications Engineering Manager – Technical Content, APAC, DigiKey Ceramic thick-film resistors, long a staple in electronic applications,...
Cadence Celebrates 20 Years in Pune, Reinforces Long-Term R&D Commitment
Pune, India, 08 January 2025: Cadence, a global leader in electronic system design, is celebrating 20 years in Pune as...
Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
Strategic collaborations with Samsung Foundry, Arm and others enable Cadence to deliver pre-validated chiplet solutions based on the Cadence Physical...
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