TDK launches industry-leading low-resistance soft-termination C0G MLCCs with 22 nF at 1000 V in the 3225 case size
New 1000 V product with a capacitance of 22 nF in the 3225 case size with C0G characteristics of low-resistance soft...
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Intel and NVIDIA to Jointly Develop AI Infrastructure and Personal Computing Products
Intel to design and manufacture custom data center and client CPUs with NVIDIA NVLink; NVIDIA to invest $5 billion in...
Infineon power modules enhance energy efficiency in Goldwind’s grid-forming wind turbines
Munich, Germany – 18 September – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Goldwind Science & Technology Co.,...
The Digital Diamond Architect: IESA & SEMI’s Tribute to Prime Minister Modi at 75
A Tribute from IESA: The Digital Diamond Architect, Prime Minister Narendra Modi National, September 18, 2025 – The India Electronics...
Arm Inaugurates New “Impact Hub” in Bengaluru to Drive Advanced 2nm Chip Design
Bengaluru, September 16, 2025 — Arm today announced the inauguration of its new office, The Impact Hub, in Bengaluru, marking...
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