SiC Modules Enable High Power Energy Infrastructure Design
Power conversion is essential for electronic products, from battery-powered Internet of Things (IoT) sensors to high-power solar inverters. In addition,...
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New i-ToF imager enables smallest 3D camera systems with improved quantum efficiency at optimized cost
Munich, Germany – 24 February, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), in collaboration with 3D time-of-flight...
Infinitesima announce first customer shipment of their ground-breaking Metron3D in-line probe metrology system
Providing improved process control for next generation Semiconductor manufacturing. Infinitesima have completed the first customer shipment of the Metron3D metrology...
Ultra-low-power bi-directional wireless mesh network modules from NeoCortec available through Endrich
Focus on smart building market makes Endrich ideal partner for NeoMesh wireless modules February 23, 2023 – NeoCortec, manufacturer of...
Ventana Micro Selects Imperas Solutions for RISC-V Processor Verification
Imperas RISC-V reference models, simulator, tests, and verification IP are supporting Ventana Micro in delivering a performance-leading family of data...
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