MEMS Sensors Must Survive Both Shock and Vibration
Product designers may assume a high shock rating means a MEMS accelerometer is rugged enough for harsh environments, but shock...
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Infineon sets new power benchmark for AI accelerators and vertical power delivery with 2 A/mm² dual-phase smart power stages
Munich, Germany – 7 September 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the TDA235E5 and TDA235E0,...
Synopsys, COEP Technological University, CADFEM to Advance Engineering Education with Strategic Digital Twin & Multiphysics Collaboration
Key Highlights: The newly established Ansys Digital Twin & Multiphysics Lab at COEP will allow students, researchers and faculty access...
Messe Muenchen India and dmg events Announce Partnership to Launch AiX DataWorld 2027
The new conference and exhibition will support the developers, operators and technology providers building the data centre infrastructure required for...
Ambarella and Macnica Enter a Long-Term Strategic Distribution Agreement to Accelerate Edge AI Infrastructure and Physical AI Adoption
Partnership expands Ambarella’s go-to-market reach through Macnica’s distribution, technical enablement and ecosystem development capabilities across the Americas and EMEA, driving significant...
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