Microchip Technology Unveils LAN878x and LAN888x Families
Next‑Generation 100/1000BASE‑T1 Single Pair Ethernet PHYs Integrate MACsec Security, Time Sensitive Networking and Functional Safety National, 13th May 2026: As...
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Siemens unveils AI-powered library characterization to accelerate semiconductor design
New AI-powered characterizer. accelerates .lib generation from weeks to days and delivers 7x greater throughput Characterizer AI engine and advanced Liberty Variation Format...
Siemens democratizes EDA software access for European electronics industry through the Chips JU European Chips Design Platform (EuroCDP) project
Streamlined access to advanced electronic design automation (EDA) software for European semiconductor innovation Lowers barrier for smaller companies, startups and...
MIT Bengaluru Builds India’s Future Semiconductor Talent Pipeline Through Rare Chip Fabrication Exposure
Bengaluru, 12th May 2026: Manipal Institute of Technology (MIT), Bengaluru, a constituent unit of the Manipal Academy of Higher Education...
Littelfuse/C&K Introduces TDB Series Ultra-Miniature Half-Pitch Surface-Mount DIP Switches
New gold-plated, washable DIP switches enable high-density PCB layouts in space-constrained designs ROSEMONT, Ill., April 21, 2026 — Littelfuse, Inc....
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