Micron Launches World’s First 176-Layer NAND in Mobile Solutions to Power Lightning-Fast 5G Experiences
Advanced 3D NAND in Micron’s mobile storage enables rich, seamless multimedia experiences India, Bangalore, July 30, 2021 – Micron Technology,...
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Tunable Linear ReDrivers from Diodes Incorporated
Support Superior Levels of Signal Integrity on High-Speed DisplayPort 2.0 and HDMI 2.1 Interfaces Plano, Texas – July 29, 2021...
Infineon introduces industry’s first USB PD 3.1 high-voltage microcontroller with higher wattage support
Munich, Germany – 29 July 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduced the industry’s first high-voltage...
FTDI Introduces Evaluation Board to Accompany its Latest Generation of USB Power Delivery ICs
29th July 2021 – To back up the company's expertise in creating advanced semiconductor technology for USB power delivery purposes,...
Nexperia’s new bipolar junction transistors in DPAK-package
Deliver high reliability performance for automotive and industrial applications MJD series now available covering 2 – 8 A and 45...
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