Extruded heat sink materials – Aluminum alloys vs copper
Heat sinks are most important components of electrical devices, they are used in everything be it any lighting equipment or...
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Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost...
New Highly Integrated Renesas PMIC Optimized For RZ/G2L And V2L MPUs Delivers Complete Power Solution To Reduce Design Time
New Device Increases System Reliability; Supports Low-Cost, Four-Layer PCB Boards August 5, 2021 TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723),...
Rohde & Schwarz demonstrates the all-new R&S RTO6 oscilloscope at DesignCon 2021
Silicon Valley’s premier event for chip, board, and systems design engineers – DesignCon – returns in 2021 to San Jose,...
First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
Microchip’s BL1, BL2 and BL3 family, developed with the Clean Sky consortium, is qualified to stringent aerospace standards for AC-to-DC...
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