DENSO Adopts SDK SiC Epi-wafers for Next-Generation Booster Power Modules for FCEVs
TOKYO, Dec 10, 2020 - Silicon carbide epitaxial wafers (SiC epi-wafers), the main material for power semiconductors, with a diameter...
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Security Solution with New Mach-NX FPGA for Next Generation, Cyber-Resilient Systems
· Adds Secure Enclave with Support for ECC 384 and SPDM Protocols, Increases System Control Customization Capabilities· Enables Hardware Root-of-Trust,...
Rutronik and Infineon add Cypress products to their franchise
Manchester, UK – 10 December 2020 – Rutronik is now the distributor for the entire product portfolio of the former...
Murata introduces the ultra-thin LW reversed
Murata’s ultra-thin LW reversed, low ESL chip MLCCs in 0204 inch size design for in-vehicle ADAS applicationsHoofddorp, Netherlands: Murata introduces...
XinaBox educational devices
element14 further enhances range of educational devices with XinaBox XinaBox’s range of educational devices and kits support students as they...
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