OpenAI and Broadcom Unveil ‘Jalapeño’ AI Chip to Power Next-Generation Inference
Custom processor marks OpenAI’s move toward owning more of its AI infrastructure, reducing dependence on third-party accelerators while improving performance...
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Melexis Tackles Signal Integrity Challenges in High-Power EVs with Digital Current Sensor
Tessenderlo-Ham, Belgium, 25 June 2026 – Melexis unveils the MLX91229, a conventional-Hall current sensor featuring a sigma-delta digital output to improve signal...
Managing Technology Continuity: The New Role of Component Distribution
Serving 300,000 customers across 150 countries, TME combines product breadth, operational excellence, and global expansion to strengthen its position among...
Murata expands Product Information Management API Service to cover all 73 product categories
Hoofddorp, Netherlands, 25 June 2026: Murata Manufacturing Co., Ltd now covers all 73 product categories in its Product Information Management (PIM) API...
Infineon introduces the AIROC™ UWB TSL100 for precise positioning and smart presence detection on a single chip
Munich, Germany – 25 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced the AIROC™ UWB...
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