QSFP-DD MSA Group releases 3.0 Hardware specification
The Quad Small Form Factor Pluggable Double Density (QSFP-DD) Multi Source Agreement (MSA) group has released an updated 3.0 Hardware...
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SDK expanding high-grade SiC epi production capacity from 3000 to 5000 wafers per month
Tokyo-based Showa Denko K.K. (SDK) has decided to expand its facilities for producing high-quality-grade silicon carbide (SiC) epitaxial wafers for...
IQE extends production of VCSEL epiwafers with Aixtron AIX 2800G4-TM MOCVD systems
Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany has received an order for multiple metal-organic chemical vapor deposition...
NCSU rolls out PRESiCE manufacturing process to open up SiC power device market to more companies
North Carolina State University (NCSU) is rolling out a new manufacturing process and chip design for silicon carbide (SiC) power...
Norstel completes 150mm SiC n-type wafer development
Norstel AB of Norrköping, Sweden has developed low-defect-density 150mm silicon carbide (SiC) n-type substrates. Norstel manufactures conductive (n-type) and semi-insulating...
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