Infineon and SOLUM strengthen collaboration on HVDC power solutions for AI data centers

Munich, Germany and Seoul, South Korea – 5 November 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and SOLUM have signed a Memorandum of Understanding (MoU) to strengthen their existing collaboration on high-voltage direct current (HVDC) power solutions for AI data centers. Building on their ongoing technical cooperation, the companies plan to expand their work across three key power applications: intermediate bus converters (IBCs), battery backup units (BBUs) and power supply units (PSUs).

As generative AI and high-performance computing drive higher power demand in data centers, energy efficiency, power density and system reliability become more important. HVDC-based power architectures are emerging as a key technology for next-generation AI data centers. They reduce power losses and improve reliability through more efficient power conversion and distribution. Infineon and SOLUM plan to combine Infineon’s semiconductor and system expertise with SOLUM’s capabilities in server power solutions and power module design and manufacturing. Together they will explore high-efficiency HVDC solutions.

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“AI data centers require power infrastructure with increasing levels of efficiency, reliability and power density,” said Adam White, Division President Power Systems at Infineon. “Korea is at the forefront of technology innovation and a strong driver of AI, and SOLUM’s server power capabilities complement what we bring on the semiconductor side. Together we want to advance HVDC power solutions for next-generation AI infrastructure.”

“AI is driving fundamental changes not only in computing performance but also in the power infrastructure that supports it,” said Jun Sung-ho, CEO of SOLUM. “By working with Infineon, a global leader in power semiconductors, we will further strengthen SOLUM’s high-voltage, high-efficiency power design capabilities and pursue new business opportunities in next-generation AI data center power markets.”

Infineon will work with SOLUM from the early stages of relevant projects to review suitable technologies and product solutions and will provide reference designs and technical support. The company brings a broad portfolio of power semiconductors solutions based on silicon (Si), silicon carbide (SiC) and gallium nitride (GaN), including CoolMOS™, OptiMOS™, CoolSiC™ and CoolGaN™ devices, as well as PSOC™ microcontrollers and sensors.

The companies will maintain a regular technical dialogue on next-generation developments. Through these efforts, Infineon and SOLUM aim to strengthen their long-term collaboration and accelerate the development of HVDC power systems for AI data centers.

Korea is a key market for AI infrastructure, and local companies build high-performing hardware that AI applications depend on. With this MoU, Infineon aims to deepen its engagement with partners in Korea and to support the region’s AI data center development with technical expertise and system understanding of AI data center power architectures.