(Waterbury, CT USA) – October 15, 2026 – MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, will present four technical papers at the IMPACT Conference 2026 and two additional presentations at the Tech X Total Solutions forum during the TPCA Show in Taipei. The presentations will introduce next-generation periodic pulse reverse (PPR) plating, immersion tin, and bottom-up fill technologies, as well as advanced final finishes and through-glass via metallization designed to address the critical manufacturing challenges facing next-generation PCB and IC substrate production.
Driven by the rapid expansion of artificial intelligence, high-performance computing, and advanced packaging technologies, PCB and IC substrate fabricators face increasing demands for finer features, higher interconnect densities, and greater process precision. Consistent copper distribution, reliable via filling, and scalable manufacturing performance have become critical to enabling the next generation of electronic devices.
At IMPACT and Tech X Total Solutions, MacDermid Alpha will present technical research and application expertise developed to address these challenges. Topics will include the use of advanced PPR plating techniques to improve copper thickness uniformity and distribution in complex HDI designs; innovations in via-filling technologies that support increasingly demanding substrate architectures; developments in final finish performance; and metallization approaches that enable emerging manufacturing platforms. The presentations will explore approaches to improve yield, reliability, and process robustness in high-complexity production environments.
Supporting these technical advancements is a portfolio of metallization solutions engineered for next-generation manufacturing. PC 710 delivers enhanced copper thickness uniformity and throwing power for advanced HDI applications. MacuSpec™ VF-TH 500 and AVF 700 provide high-performance via-filling capabilities for demanding substrate and packaging requirements, while Shadow® Plus offers a graphite-based direct metallization process that supports complex designs as an alternative to traditional electroless copper processes.
“As the industry pushes the boundaries of PCB and IC substrate technology, manufacturing success increasingly depends on a deep understanding of metallization science and process integration,” said Martin Bunce, Line of Business Director, Secondary Metallization at MacDermid Alpha Electronics Solutions. we are sharing expertise that helps fabricators address increasingly complex manufacturing challenges and supports reliable, scalable production.”
Visitors can meet MacDermid Alpha technical experts at Booth #L513 during the TPCA Show 2026 in Taipei, to discuss application specific manufacturing challenges and explore advanced metallization solutions. For more information, visit the event page.
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