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Nexperia unveils Next Gen Low-Voltage Analog Switches
To simplify Automotive and Industrial System Designs Nijmegen, March 05, 2024: Nexperia, the global semiconductor manufacturer, today introduced a new...
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Wise-integration Raises €15 Million in Series B Funding Round to Support International Growth for Its Innovative GaN Solutions
The Round Includes Leading Deep Tech Funds and Will Enable Mass Production and Commercial Deployment of WiseGan® and WiseWare® Hyeres,...
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SEGGER delivers Ozone for Windows on Arm
Monheim am Rhein, Germany – February 28th, 2024 SEGGER announces that its debugger and performance analyzer, Ozone, is now available...
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Nexperia broadens its range of discrete FET solutions at APEC 2024
Leveraging R&D expertise to deliver space-saving PoE ASFETs and EMC-optimized NextPowerS3 MOSFETs. Nijmegen, February 27, 2024: Nexperia is once again...
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Infineon unveils high density power modules to enable benchmark performance and TCO for AI data centers
Munich, Germany, Long Beach, California – 26 February 2024 – Artificial Intelligence is currently driving an exponential increase in global...
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Renesas Launches New 32-bit MCU for High-end Industrial Sensor Systems
Renesas Introduces 32-bit RX MCU with High-Speed, High-Precision Analog Front End for High-End Industrial Sensor Systems New RX23E-B Boasts x8...
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Qualcomm announced Groundbreaking Innovations at MWC Barcelona
Highlights: Groundbreaking advancements in AI, 5G, and Wi-Fi will spearhead a new era of intelligent computing everywhere, revolutionizing industries, devices,...
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Sivers Semiconductors showcasing the broadest mmWave portfolio on the market at Mobile World Congress 2024
Kista // Sweden// Feb 23, 2024 // Sivers Semiconductors (STO:SIVE) will showcase its industry-leading mmWave portfolio of 5GmmWave, unlicensed 5G,...
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STMicroelectronics announces two new 3D ToF sensors
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced an all-in-one, direct Time-of-Flight...
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Renesas Develops New AI Accelerator for Lightweight AI Models and Embedded Processor Technology
Results of Operation Verification Using an Embedded AI-MPU Prototype Announced at ISSCC 2024 TOKYO, Japan, February 22, 2024 ― Renesas...
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