Gold has long been the favorite for the all-important bonding wire in semiconductor chips, but copper is fast replacing the...
Read moreUniversity Grenoble Alpes and Soitec S.A. in France have used layer transfer techniques to create indium gallium nitride on oxide/sapphire...
Read moreUK-based Oxford Instruments says that a world-first non-destructive quality control method developed by the UK’s National Physical Laboratory (NPL) has...
Read moreToyoda Gosei Co Ltd of Kiyosu, Aichi Prefecture, Japan has developed its first automotive headlamp LED as a new product....
Read moreFHR Anlagenbau GmbH of Ottendorf-Okrilla, Germany (a subsidiary of centrotherm international AG) has won a contract from Reutlingen-based Manz AG...
Read more'Controlled spalling' technique holds promise for improved thermal characteristics, lightweight stackability and flexibility Integrated circuits made on thin layers hold...
Read moreCompany wins EPIC Award for overall 'Excellence in Performance, Innovation & Collaboration' Semiconductor wafer company IQE is hosting the 2017...
Read morePatent infringement lawsuit targets LED in HTC U Ultra phone Nichia Corporation has filed a patent infringement lawsuit in Germany...
Read moreMethod from the UK's National Physical Laboratory enables Oxford to carry out non-destructive quality control checks While graphene was the...
Read moreGlobal Automotive Drive belts market is expected to reach USD XXXX billion in 2022. Global Automotive Drive belts market is anticipated to...
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