The Audi e-tron FE06 in its new design Successful partnership in development intensified Waldenburg (Germany), 26 November 2019 – Last...
Read moreDetailsQualcomm Technologies, Inc. and Siemens have setup a joint proof-of-concept project at the Siemens Automotive Test Center in Nuremberg, Germany,...
Read moreDetailsDüsseldorf, Germany, 26 November 2019 - Toshiba Electronics Europe GmbH today announced that Toshiba Electronic Devices & Storage Corporation Visconti™ 4 image recognition processor...
Read moreDetailsThe newly developed low energy PAN1740A Bluetooth 5.0 module features a compact size and fast boot time for IIot and...
Read moreDetailsMediaTek announces 5G modem optimized for key laptop segments HSINCHU, Taiwan, Nov. 25, 2019 -- MediaTek today announced it is partnering with Intel to...
Read moreDetailsSanta Clara – November 20, 2019 – California Eastern Laboratories (CEL) and LITEC Corporation announce a partnership allowing CEL to exclusively...
Read moreDetailsFor robust, reliable connections in railway technology and other high-performance Ethernet systems. Pforzheim – 21 November 2019 – High-speed Ethernet...
Read moreDetailsManchester, UK – 21 November 2019 – HKC (Hong Kong X’tals) presents its GNSSDO (Global Navigation Satellite System Disciplined Oscillator)...
Read moreDetails21st November 2019 – Expanding its PanL building automation portfolio, Bridgetek has now formally launched solutions targeted at the office...
Read moreDetailsAllegro MicroSystems Launches First Magnetic Gear Tooth Sensor IC Designed for Traction Motors Built on decades of automotive speed sensor...
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