Semiconductor News
Semiconductor For You brings you the latest semiconductor news from around the world, whether it's the latest advances in electronic or semiconductor components.
EDOM Technology Strengthens Its Role in Integrating the Physical AI Ecosystem
Driving the Industrial Deployment and Real-World Value of the NVIDIA IGX Thor Development Kit March 18, 2026 – Taipei – EDOM Technology (TWSE:...
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OpenLight and TFC Advance Silicon Photonics Back‑End Integration Supporting up to 400G Data Rates on TGV Substrate
New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and...
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Samtec AcceleRate® Slim Cable Assemblies Available with New Signaling Options
AcceleRate Slim Cable Assemblies support high-density computing, FPGA prototyping and emulation, and MIPI protocols with new signaling options. New...
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Cadence Appoints Dr. Alok Jain as Managing Director for India
Noida, 17 March 2026, Cadence, a global leader in computational software, today announced the appointment of Dr. Alok Jain as the managing director for the India...
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Bengaluru Gets a World-Class Electronics Co-Innovation Hub as Henkel Launches Advanced Application Center
With India's electronics output growing six-fold in a decade, Henkel opens a co-innovation hub designed for what comes next. Bengaluru,...
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Littelfuse Launches CPC1343G OptoMOS® Solid-State Relay for High-Current, High-Isolation Applications
New 60 V, 900 mA normally open SSR delivers 5,000 VRMS reinforced isolation and reliable operation up to +105 °C...
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Siemens launches Fuse EDA AI Agent
Fuse EDA AI Agent autonomously orchestrates multi-agent workflows across Siemens' complete electronic design automation (EDA) portfolio, from design conception through...
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Infineon and NVIDIA Expand Collaboration to Advance Safe Humanoid Robotics
Mar 16, 2026 Infineon to accelerate next-generation humanoid robots enabled by digital twins in collaboration with NVIDIA Scalable deployment of...
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Navitas Debuts Revolutionary 800 V–6 V Power Delivery Board at NVIDIA GTC 2026
The breakthrough, 800 V–6 VDC-DC power delivery board eliminates traditional 48V intermediate bus converter stage while improving system efficiency, reliability,...
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Communication modules are becoming secure connectivity platforms for the software-defined era
As wireless connectivity becomes central to automotive, industrial IoT, and smart infrastructure, Vaishali Umredkar, Editor of Semiconductor For You speaks...
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