Inside HVPAK: A Deep Dive into Architecture and Capabilities
Authors: Volodymyr Ilchuk, Team Lead, Application Engineering and Irena Zhuravchak, Application Engineer, Lviv, Renesas, Ukraine This article focuses on the ...
Read moreDetailsAuthors: Volodymyr Ilchuk, Team Lead, Application Engineering and Irena Zhuravchak, Application Engineer, Lviv, Renesas, Ukraine This article focuses on the ...
Read moreDetailsMarch 17, 2026 TDK Corporation (TSE:6762) introduces the TDK-Lambda i1R ORing FET modules, capable of operating at 60 or 80 ...
Read moreDetailsNew 60 V, 900 mA normally open SSR delivers 5,000 VRMS reinforced isolation and reliable operation up to +105 °C ...
Read moreDetailsMar 16, 2026 Infineon to accelerate next-generation humanoid robots enabled by digital twins in collaboration with NVIDIA Scalable deployment of ...
Read moreDetailsPlano, Texas – March 12, 2026 – Diodes Incorporated (Diodes) (Nasdaq: DIOD) strengthens its power management portfolio with the introduction of ...
Read moreDetailsTony Ng, Vice President for APAC, DigiKey As surging global demand for electronics fuels growth in industrial automation, robotics, EVs, ...
Read moreDetailsFirst open end-to-end electronics development platform unites device exploration, model-based system development, device lifecycle management and early concept validation in ...
Read moreDetailsMarch 9, 2026 – Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of ...
Read moreDetailsNUREMBERG, Germany — March 10, 2026 — Octopart, an Altium company, today introduced Octopart Discover, the next evolution of Octopart that brings design intent and ...
Read moreDetailsNuremberg, Germany – 10th March 2026 Nanopower Semiconductor, a European fabless semiconductor manufacturer, announces that their award winning nPZero power-saving integrated ...
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