Renesas Introduces New AnalogPAK Programmable Mixed-Signal ICs
Devices Reduce Component Count, BOM Cost and Board Space in Almost Any Application TOKYO, Japan, November 12, 2024 ― Renesas ...
Read moreDetailsDevices Reduce Component Count, BOM Cost and Board Space in Almost Any Application TOKYO, Japan, November 12, 2024 ― Renesas ...
Read moreDetailsIncreasing power converter efficiency while also delivering smoother motor control Nijmegen, November 12, 2024: Nexperia today introduced a new series ...
Read moreDetailsNew E-Axle Solution to be Showcased in a Live Demonstration at electronica 2024, Munich, Germany from November 12-15 TOKYO, Japan, ...
Read moreDetailsSmartAutomotiveTM IAM-20685HP and IAM-20689 are second generation 6-axis MEMS IMUs suited for safety-relevant automotive applications up to ASIL D Compact in size ...
Read moreDetailsNews highlights: The new TMS320F28P55x series of C2000™ MCUs with an integrated edge artificial intelligence (AI) hardware accelerator enables smarter ...
Read moreDetailsThe Treo Platform features a modular architecture to accelerate development of intelligent power management, sensor interface and communications solutions NEWS ...
Read moreDetailsHoofddorp, Netherlands: Murata is pleased to unveil ZENCROSS™, an alliance offering integrated hardware, firmware and network services platform designed to address ...
Read moreDetailsInitial efforts to focus on silicon carbide MOSFETs in QDPAK for onboard chargers Nijmegen, November 5, 2024: Nexperia today announced ...
Read moreDetailsMunich, Germany – 4 November 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of ...
Read moreDetailsInnovative Solution Offers Highly Compact Form Factor Combined with Improved Battery Life, Enabling the Next Generation of AI PCs TOKYO, ...
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