ST Foundation Strengthens India Mission
Global ST Foundation leadership joins India media briefing virtually, reaffirming commitment to STEM access and community empowerment Outlines Vision for...
SYSGO Showcases Real-Time Safety, Security, and CRA Readiness at Embedded World 2026
Klein-Winternheim, Germany, 25 February 2026 – SYSGO will once again be at the heart of innovation when the global embedded community gathers...
Vishay Intertechnology Phototransistor Optocouplers Deliver Accuracy and Energy Efficiency for Industrial Applications
Devices Combine High, Linear CTR Range With Low Forward Current of 0.5 mA and High Temperature Operation to +125 °C...
TDK extends X2 portfolio with compact 350 V (AC) capacitors for industrial and automotive
February 25, 2026 TDK Corporation (TSE:6762) extends its X2 safety film capacitor portfolio with the new B3292xU/V series, now supporting higher voltages and offering compact...
element14 Community launches smart security and surveillance design challenge
Design challenge encourages engineers to create innovative security projects and compete for prizes Bengaluru, India – 25 February 2026: element14, an Avnet...
Rohde & Schwarz and LITEON demonstrate high‑throughput 5G femtocell testing with the PVT360A
Rohde & Schwarz and LITEON collaborate to showcase a production-optimized test setup for high-throughput multi-device testing at MWC Barcelona 2026....
From Sofia to Kyoto: Murata and Endeavor Showcase Bulgarian Deep Tech at KUMIHIMO Tech Camp Finale
25 February 2026 - Murata Manufacturing and Endeavor Bulgaria have announced three winning companies of the 2025 KUMIHIMO Tech Camp during a...
Samtec Interconnects Selected for VITA 90 VNX+
Samtec interconnects selected to improve signal integrity and reduce SWaP of evolving VITA standards requiring miniaturization and functionality advancements. VITA™ 90...
HARMAN Embedded Audio Showcases Connected Device Innovation at Mobile World Congress 2026
BARCELONA — Feb. 24, 2026 — HARMAN Embedded Audio (HEA), a leading end‑to‑end B2B embedded audio solutions provider, announced it will showcase...
Teledyne FLIR OEM Launches Lepton XDS at Mobile World Congress; A Compact Thermal‑Visible Camera Module Featuring Patented MSX Technology
Prism™ ISP–Powered Dual Camera Module Delivers Enhanced Performance and Faster Integration for OEMs BARCELONA and GOLETA, Calif.,– Teledyne FLIR OEM, a...
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