Infineon introduces Industry’s first automotive qualified SiC six-pack power module
Munich, Germany – 3 May 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced a new automotive...
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STMicroelectronics and OQmented to Jointly Develop, Manufacture, and Market Advanced MEMS Mirror-Based Laser-Beam Scanning Solutions
Agreement focuses on increasing development and capacity for ultra-compact, low-power laser-beam scanners to expand the market May 3, 2021: STMicroelectronics...
Infineon 2300 V isolated EiceDRIVER™ 2L-SRC Compact
Optimizing system efficiency and EMI in the most compact form factor Munich, Germany – 30 April 2021 – Highest efficiency...
Recom switching regulator family at Rutronik for optimum thermal management
Manchester, UK – 30 April 2021 – Ultra-compact switching regulator module: Recom‘s RPMH-1.5 series is a 1.5A non-isolated switching regulator...
Fabless Suppliers Held a Record 33% of the 2020 IC Market
Fabless IC suppliers registered a strong 24% surge in sales last year as compared to only an 8% increase by...
GaN Systems Shows How GaN is Now Mainstream at PCIM Europe 2021
OTTAWA, Ontario, April 29, 2021 – GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, today announced its...
Molex Scales Deployments of High-Speed Interconnect Solutions to Meet Next-Generation Hyperscale and Enterprise Data Center Demands
Delivery of 400G and 100G optics support data center, cloud and wireless applications New 112G Active Electrical Cables join family...
Ericsson launches three-sector radio for efficient site upgrades and capacity boost
New Delhi, April 29 2021: Ericsson has launched Radio 6626, a unique three-sector dual-band radio to help service providers increase...
Microchip licenses SEGGER’s emFloat floating-point library for the XC32 V4.0 compiler toolchain
Monheim am Rhein, Germany – 29th April 2021 SEGGER Microcontroller announces that Microchip Technology Inc., a leading provider of smart,...
New EasyDUAL™ CoolSiC™ MOSFET power modules with high-performance ceramic
Munich, Germany – 29 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has upgraded the EasyDUAL™ CoolSiC™...
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