PICMG COM-HPC 1.2 “Mini” Brings PCIe 5.0, USB4 & 10 GbE to Far Edge
95 mm x 70 mm Form Factor COM specification brings low power and high-performance interfaces to drones, mobile robots, and...
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Nordic announces nRF54L Series
Expanding industry's most efficient Bluetooth LE portfolio New groundbreaking nRF54L Series succeeds Nordic Semiconductor’s market-leading nRF52 Series, setting a new...
Infineon with adidas develops Lighting Shoe prototype
Munich, October 12, 2023 - As a leading global semiconductor manufacturer for power systems and IoT, Infineon Technologies AG (FSE:...
Renesas Partners with EdgeCortix to Streamline AI/ML Development
Strategic Collaboration Will Accelerate Unification of Developer Experience Across Renesas' Wide Embedded Processing Portfolio; Offers Support for Heterogeneous Architectures TOKYO,...
Power Integrations and SnapMagic Collaborate to Advance Power Supply Design Automation
From PSU specification to PCB layout in minutes using PI Expert and SnapMagic San Jose and San Francisco, Calif. –...
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