IQE extends production of VCSEL epiwafers with Aixtron AIX 2800G4-TM MOCVD systems
Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany has received an order for multiple metal-organic chemical vapor deposition...
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NCSU rolls out PRESiCE manufacturing process to open up SiC power device market to more companies
North Carolina State University (NCSU) is rolling out a new manufacturing process and chip design for silicon carbide (SiC) power...
Norstel completes 150mm SiC n-type wafer development
Norstel AB of Norrköping, Sweden has developed low-defect-density 150mm silicon carbide (SiC) n-type substrates. Norstel manufactures conductive (n-type) and semi-insulating...
100G Lambda MSA to define specification for next-generation optical links
The 100G Lambda Multi-Source Agreement (MSA) Group has announced their intent to develop specifications based on 100Gbps per wavelength optical...
Evatec expanding Greater China operations to support rapid business growth
Evatec Ltd of Trübbach, Switzerland (which makes thin-film deposition and etch processing equipment for advanced packaging, power device, MEMS, optoelectronics,...
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