AuraML Unveils Multimodal World Simulation Model Built on NVIDIA AI Infrastructure
Highlights- AuraML partners with NVIDIA to build a multimodal world simulation platform for robotics and logistics Launches AuraSim, India’s first...
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Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
Scalability and functional safety enabled by chiplet technology Auto-grade quality for large, modern AI NPUs Advanced power control for higher...
Renesas Develops 3nm TCAM Technology Combining High Memory Density and Low Power, Suitable for Automotive SoCs
Achieves flexible, small-block configuration for large-scale TCAMs Cuts search energy and boosts speed through efficient search processing Enhanced functional safety...
VIAVI to Showcase Test Solutions across Security, Quantum-safe, AIOps, AI data center, 6G and AI-RAN at MWC Barcelona
Bangalore - Feb 19, 2026 - VIAVI Solutions has announced its demonstration lineup for Mobile World Congress (MWC) Barcelona 2026, which takes place March...
GlobalFoundries and Renesas Expand Partnership to Accelerate U.S. Semiconductor Manufacturing
Multi‑billion-dollar collaboration strengthens supply chain resiliency and supports growing demand for chips powering smart vehicles and next-generation industrial systems MALTA,...
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