From Sofia to Kyoto: Murata and Endeavor Showcase Bulgarian Deep Tech at KUMIHIMO Tech Camp Finale
25 February 2026 - Murata Manufacturing and Endeavor Bulgaria have announced three winning companies of the 2025 KUMIHIMO Tech Camp during a...
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Samtec Interconnects Selected for VITA 90 VNX+
Samtec interconnects selected to improve signal integrity and reduce SWaP of evolving VITA standards requiring miniaturization and functionality advancements. VITA™ 90...
HARMAN Embedded Audio Showcases Connected Device Innovation at Mobile World Congress 2026
BARCELONA — Feb. 24, 2026 — HARMAN Embedded Audio (HEA), a leading end‑to‑end B2B embedded audio solutions provider, announced it will showcase...
Teledyne FLIR OEM Launches Lepton XDS at Mobile World Congress; A Compact Thermal‑Visible Camera Module Featuring Patented MSX Technology
Prism™ ISP–Powered Dual Camera Module Delivers Enhanced Performance and Faster Integration for OEMs BARCELONA and GOLETA, Calif.,– Teledyne FLIR OEM, a...
VIAVI announces DCX 700 tier 1 optical loss test set for testing up to 24 fibers
Bangalore - February 25, 2026 – VIAVI Solutions has announced the DCX 700 tier 1 optical loss test set for testing up to...
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