Semiconductor Packaging & SoC Design
Antonio Velasco The word "semiconductor" is a strong buzzword. They drive the stock market, enable all of our electronics and...
Latest News
Bosch introduces third generation SiC chips for EV growth and local ecosystem enablement
▶ The new generation of SiC chips deliver 20 percent higher performance ▶ More than 60 million SiC chips already delivered worldwide...
Nexperia brings QDPAK packaging to 1200 V SiC MOSFETs to overcome thermal bottlenecks in high-power designs
Top-side cooled SMD package provides a practical route to higher power density and system efficiency while simplifying heatsink and mechanical...
Navitas Introduces Isolated Through-Hole Package for SiC MOSFETs, Enabling Direct-Cooled Thermal Management
Direct-cooled thermal management offered by a reflow-compatible, isolated thermal pad significantly improves power density, reliability, and efficiency. Integrated aluminum nitride...
Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
Expanded cooperation spans DTCO, IP readiness and design enablement to advance next-generation customer innovation National, India, June 8, 2026;...
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