Infineon introduces industry’s first AEC-Q103 qualified high-performance XENSIV™ MEMS microphone for automotive applications
Munich, Germany – 16 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of...
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Kick-off: Rutronik and Elmos launch partnership
Focus on automotive semiconductor solutions & international sales channels Manchester, UK – 15 April 2021 – Elmos Semiconductor SE and...
SEGGER J-Link now supports CMSIS-DAP: One Probe Fits All
Monheim am Rhein, Germany – 15th April 2021 SEGGER's latest J-Link software makes it possible to turn J-Link into a...
32bit D/A Converter IC for Hi-Fi Audio Equipment
ROHM's first, most advanced MUS-ICTM series DAC chip enables expressive playback of classical music ROHM announces the new BD34301EKV, a...
InnovationLab wins ‘best prototype / new product’ at global OE-A awards
OccluSense® by Bausch recognised for innovation Heidelberg, Germany – April 14, 2021 – InnovationLab, the expert in printed electronics "from...
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