Semiconductor News
Semiconductor For You brings you the latest semiconductor news from around the world, whether it's the latest advances in electronic or semiconductor components.
Cadence AI Super Agents Enable Nokia to Accelerate Electronic System Design on Millennium M2000 Supercomputer
Cadence AuraStack AI Super Agent and Millennium M2000 AI Supercomputer, powered by NVIDIA Blackwell GPUs and NVIDIA CUDA-X, help Nokia...
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Microchip Adds the LX-820 Quartz Oscillator to its L-Series Timing Portfolio Developed for Low Earth Orbit Applications
The company’s L-Series timing devices are designed to scale between COTS and traditional space-grade solutions, offering shorter lead times at...
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Siemens expands agentic AI collaboration to tackle 3D IC power and thermal challenges with NVIDIA
Builds on agentic AI capabilities introduced at DAC 2026, extending them to 3D integrated circuits (3D IC) electrothermal codesign Orchestrates...
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Renesas Launches New 32-bit 600 MHz MCUs with Embedded MRAM
Up to 600 MHz RXv3e core and high-speed MRAM deliver fast, reliable real-time performance. RX74M supports major industrial networks—including EtherCAT,...
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Your Next-Gen Seatbelt Buckle Switch is Here to Stay
Tessenderlo-Ham, Belgium, 22 October 2026 – Expanding on the industry’s widest sensing portfolio, Melexis introduces the MLX92342, a 2-wire PCB-less...
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UnternehmerTUM Accelerator, Microsoft, Infineon Technologies, and NVIDIA Launch Physical AI Growth Lab for Europe’s Most Promising Startups
Munich, Germany – 22 October 2026 – UnternehmerTUM Accelerator, Microsoft, Infineon, and NVIDIA, today launched the Physical AI Growth Lab,...
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Inertial Labs, a VIAVI company launches INS-NV, a programmable INS development platform
Bangalore - October 23, 2026 – Inertial Labs, a VIAVI Company, today launched the INS-NV, a programmable development platform that combines inertial navigation system (INS), attitude...
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Broadcom to Advance NTT DOCOMO’s Private Cloud with VMware Cloud Foundation
Company’s First 10-year VMware Software Agreement in Japan Strengthens Infrastructure Resilience and Lays the Foundation for Next-generation Services TOKYO, Oct....
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TE Connectivity introduces TE MINI FAKRA connector system for next-generation automotive data connectivity
Compact connector system enables high-speed data transmission for increasingly data-driven vehicle architectures BENSHEIM, Germany – 10/14/2026 – TE Connectivity, a...
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Infineon collaborates with NVIDIA on gallium nitride-based power conversion systems for 800 VDC AI data centers
Munich, Germany – 21 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is advancing its collaboration with...
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