See the QSiC™Gen3 line, now offering high-thermal-performance options featuring AlN substrates and pre-applied TIM, on display at Booth #110 in...
Read moreDetailsTessenderlo-Ham, Belgium, 4 June 2026 – Melexis unveils the MLX92344, a highly flexible PCB-less solution for contactless detection of up to four...
Read moreDetailsTaipei, Taiwan, June 3, 2026 – Synaptics® Incorporated (Nasdaq: SYNA), Accton Technology Corporation, Gallopwave Incorporation, and Hsuan Yuan Technology Co. Ltd. (“HYTech”)...
Read moreDetailsMurata Manufacturing Co., Ltd. introduces the GCJ21BD72A225KE02, a soft-termination chip multilayer ceramic capacitor (MLCC) for automotive powertrain and safety equipment....
Read moreDetailsGREENSBORO, NC – June 3, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today...
Read moreDetailsNew analyzers help engineers capture more signal behavior with faster measurements, reducing rework and accelerating wireless design and validation SANTA...
Read moreDetailsTORRANCE, CA – Jun 3rd, 2026 — Navitas Semiconductor (Nasdaq: NVTS), an industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power...
Read moreDetailsNew DC-DC Converters deliver best-in-class peak power efficiency and density DENVER, Colo., June 3, 2026 — Advanced Energy Industries, Inc. (Nasdaq: AEIS), a...
Read moreDetailsMunich, 03 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announces the integration of its OPTIGA™...
Read moreDetailsEnables hyperscalers to scale with high-bandwidth, low-latency, power-efficient optical connectivity SAN JOSE, Calif. — June 2, 2026 — Ayar Labs, the...
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