Tag: MOSFETS

DFN0603 package improves performance while reducing space needs significantly Nijmegen, July 6, 2022: Nexperia, the expert in essential semiconductors, today ...

UTAC Holdings Ltd. (UTAC), a global semiconductor test and assembly services provider, is announcing a punch copper (Cu) clip packaging ...

Plano, Texas – May 18, 2022 – Diodes Incorporated (Diodes) (Nasdaq: DIOD) has announced the PowerDI®8080-5, an innovative high current, ...

Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and ...

To integrate silicon-carbide power technology in next-generation electric-vehicle drives Long-term engineering and component-supply cooperation with ST contributes to success as ...

In-person talks and demos aim to inspire innovative power designs Nijmegen, April 21, 2022: Nexperia, the expert in essential semiconductors, ...

Munich, Germany – 13 April 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a new CoolSiC™ technology: ...

New models also enable investigation of EMC performance even before prototyping Nijmegen, March 24, 2022: Nexperia, the expert in essential ...

3.3 kV SiC MOSFETs and Schottky Barrier Diodes(SBDs) extend designers’ options for high-voltage power electronics in transportation, energy and industrial ...

Munich, Germany – 21 March, 2022 – Megatrends like digitalization, urbanization, and electromobility lead to increased power consumption. At the ...