New EasyDUAL™ CoolSiC™ MOSFET power modules with high-performance ceramic
Munich, Germany – 29 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has upgraded the EasyDUAL™ CoolSiC™ ...
Read moreDetailsMunich, Germany – 29 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has upgraded the EasyDUAL™ CoolSiC™ ...
Read moreDetailsNew isolated gate driver board delivers compact, high-performance design for power modules AUSTIN, Texas – February 17, 2021 – Silicon ...
Read moreDetailsTested and proven resiliency to 50kilorad of total ionizing dose and immune to single-event upsets Andover, MA –– Vicor (VICR ...
Read moreDetailsTOKYO, Dec 10, 2020 - Silicon carbide epitaxial wafers (SiC epi-wafers), the main material for power semiconductors, with a diameter ...
Read moreDetailsAccording to a recent study from market research firm Global Market Insights,The intelligent power module market is expected to register ...
Read moreDetailsMunich, Germany – 2 November 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a 1200 V ...
Read moreDetailsMunich, Germany – 30 July, 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a new IGBT power module tailored ...
Read moreDetailsAndover, MA – May 14,2020–Vicor Corporation (NASDAQ: VICR) today announced a ChiP-set for high performance GPU, CPU, and ASIC (“XPU”) ...
Read moreDetailsThe SARA-R410M-73B LTE-M modules secure the IoT from end to end. Thalwil, Switzerland, and Seoul, South Korea – January 3, ...
Read moreDetails• High performance/price ratio • Compact half-brick package saves space • High efficiency of ...
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