Infineon presents H7 variant of the Gen7 discrete 650 V TRENCHSTOP™ IGBTs
Munich, Germany – 23 August, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its 7th generation TRENCHSTOP™ ...
Read moreDetailsMunich, Germany – 23 August, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its 7th generation TRENCHSTOP™ ...
Read moreDetailsSmartDisplayer Technology’s BobeePass FIDO card uses Nordic nRF52840 or nRF52832 SoC for secure, multiprotocol connectivity A new smart card developed ...
Read moreDetailsDallas, Texas, and Munich, Germany – 17 August 2023 – Spark Connected, a global leader in developing advanced, safe and ...
Read moreDetailsCellular IoT SiP and flagship multiprotocol SoC gain PSA Certified Level 2 verifying protection against scalable, remote software attacks ...
Read moreDetailsMunich, Germany – 10 August, 2023 – The electrification of the transportation system is advancing continuously. In addition to passenger ...
Read moreDetailsThe Acquisition of Sequans Will Allow Renesas to Extend More Comprehensive IoT Solution Offering TOKYO, Japan and PARIS, France – ...
Read moreDetailsCustomers can now design and debug software for Renesas Embedded Processors in VS Code; Complements Renesas' Own e2 studio IDE ...
Read moreDetailsThe event will offer deep insight into cutting-edge technologies and innovations in chip-making and will bring together the biggest names ...
Read moreDetailsMunich, Germany – 21 July, 2023 – In static switching applications, power designs focus on minimizing conduction losses, optimizing thermal ...
Read moreDetailsBorgWarner will integrate onsemi EliteSiC 1200 V and 750 V power devices into its VIPER power modules for traction inverter ...
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