Munich, Germany, January 4, 2022 – The requirements for good air quality are on the rise especially due to the...

Munich, Germany – 4 January, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the AIROC™ CYW20829...

Solution combines the low power, high performance, and security of STM32 MCUs with Sierra Wireless’ resilient, global cellular connectivity and...

ST’s latest-generation silicon-carbide (SiC) power devices extend leadership in performance and reliability for e-mobility and energy-efficient industry Continued long-term investment...

Dec 24, 2021 STMicroelectronics has announced new STM32Cube software packs and tools, as well as evaluation boards, to accelerate development...

Munich, Germany, and El Segundo, California – 23 December 2021 – Next Saturday, 25 December, NASA plans to launch James...

Nordic’s Matter solutions, Thingy:53, LE Audio development kit, Thingy:91 and nRF Cloud Location Services power a range of innovative demonstrations...

Munich, Germany, and Las Vegas, USA – December 22, 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today...

San Diego, CA, 21 December, 2021 : congatec – a leading vendor of embedded and edge computing technology – is...

December 21, 2021, Łódź, Poland – Transfer Multisort Elektronik (TME), the Poland-based component distributor, has further strengthened its portfolio of...