ST kickstarts production of new 300mm chip for improved hyperscaler operations
PIC100 technology in 300 mm high-volume production for leading hyperscalers, with plans to quadruple capacity by 2027 and further expand in...
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GigaDevice Strengthens Global Presence at Embedded World 2026
Showcasing System-Level Innovations for Humanoid Robotics, Industry, and Edge AI Wide range of demonstrations on display at Hall 5, 5-129 throughout...
Infineon and Subaru collaborate to improve driver safety by enhancing real-time performance in ADAS
Munich, Germany, and Tokyo, Japan – 9 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Subaru...
Building India’s Automotive Workforce for a Technology-Driven Future
Arindam Lahiri, CEO, ASDC As India’s mobility ecosystem undergoes rapid technological transformation, the importance of a skilled workforce has become...
Arrow Electronics and NXP Align Risk Analysis, Secure Design and Provisioning
Security by design, addressing the requirements for the EU Cyber Resilience Act Neu-Isenburg, March 9, 2026 - Arrow Electronics is collaborating with...
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