Infineon introduces the new IPM series CIPOS™ Tiny IM323-L6G for maximum efficiency and design flexibility
Munich, Germany – 22 April, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) adds a new member to...
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X-FAB Announces Upgrade to its Substrate Coupling Analysis Tool to Include BCD-on-SOI Process
Tessenderlo, Belgium – April 20, 2022 X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has expanded the scope...
Murata introduces metal power inductors for automotive applications up to 150 °C that set new benchmarks in Isat and RDC
Murata announces the availability of the DFE32CAH_R0 series of metal power inductors high-temperature applications of up to 150 °C. Intended...
Nexperia bring power electronics expertise live to PCIM 2022
In-person talks and demos aim to inspire innovative power designs Nijmegen, April 21, 2022: Nexperia, the expert in essential semiconductors,...
BittWare Announces Partner Program to De-Risk Innovation and Reduce Time-to-Market for FPGA-Based Solutions
Pairing new IP and solutions with BittWare's compute, network, storage and sensor processing accelerator products reduces risk while accelerating time...
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