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Murata Launches Common Mode Choke Coils with Metal Terminal Structure for Automotive CAN FD Supporting Maximum Operating Temperature of 150°C

Semiconductor News

Shaping the Future of Electronics: Mouser at Electronica India 2026

AI & Data Center

DigiKey Sponsors electronica India Tech Challenge 2026

Power Management

TDK launches non-isolated 12.5 kW three-phase power supplies for Distributed Power Architectures

Semiconductor News

Vishay Intertechnology XClampR® Bidirectional Flat Clamping TVS in DO-218AC Package Deliver Low Clamping Voltage, High Power Density

Murata Launches Common Mode Choke Coils with Metal Terminal Structure for Automotive CAN FD Supporting Maximum Operating Temperature of 150°C

Shaping the Future of Electronics: Mouser at Electronica India 2026

DigiKey Sponsors electronica India Tech Challenge 2026

TDK launches non-isolated 12.5 kW three-phase power supplies for Distributed Power Architectures

Vishay Intertechnology XClampR® Bidirectional Flat Clamping TVS in DO-218AC Package Deliver Low Clamping Voltage, High Power Density

Latest News

Murata Launches Common Mode Choke Coils with Metal Terminal Structure for Automotive CAN FD Supporting Maximum Operating Temperature of 150°C

Automotive

Murata Launches Common Mode Choke Coils with Metal Terminal Structure for Automotive CAN FD Supporting Maximum Operating Temperature of 150°C

September 12, 2026

Shaping the Future of Electronics: Mouser at Electronica India 2026

Semiconductor News

Shaping the Future of Electronics: Mouser at Electronica India 2026

September 11, 2026

DigiKey Sponsors electronica India Tech Challenge 2026

AI & Data Center

DigiKey Sponsors electronica India Tech Challenge 2026

September 11, 2026

TDK launches non-isolated 12.5 kW three-phase power supplies for Distributed Power Architectures

Power Management

TDK launches non-isolated 12.5 kW three-phase power supplies for Distributed Power Architectures

September 10, 2026

Vishay Intertechnology XClampR® Bidirectional Flat Clamping TVS in DO-218AC Package Deliver Low Clamping Voltage, High Power Density

Semiconductor News

Vishay Intertechnology XClampR® Bidirectional Flat Clamping TVS in DO-218AC Package Deliver Low Clamping Voltage, High Power Density

September 10, 2026

Design & Manufacturing

MacDermid Alpha Addresses Growing Demands for Electronics Reliability and Manufacturing Performance at Productronica India 2026

September 10, 2026

Renesas Launches New MCUs for Human Machine Interface and IoT Edge Systems

Robotics

Renesas Launches New MCUs for Human Machine Interface and IoT Edge Systems

September 10, 2026

Renesas to Showcase Technologies Driving Future of AI — Software-Defined Vehicle and Intelligence at the Edge — at electronica India 202

Automotive

Renesas to Showcase Technologies Driving Future of AI — Software-Defined Vehicle and Intelligence at the Edge — at electronica India 202

September 10, 2026

Latest Review

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Business

Murata Launches Common Mode Choke Coils with Metal Terminal Structure for Automotive CAN FD Supporting Maximum Operating Temperature of 150°C

Murata Launches Common Mode Choke Coils with Metal Terminal Structure for Automotive CAN FD Supporting Maximum Operating Temperature of 150°C

September 12, 2026

Shaping the Future of Electronics: Mouser at Electronica India 2026

DigiKey Sponsors electronica India Tech Challenge 2026

TDK launches non-isolated 12.5 kW three-phase power supplies for Distributed Power Architectures

Politics

Vishay Intertechnology XClampR® Bidirectional Flat Clamping TVS in DO-218AC Package Deliver Low Clamping Voltage, High Power Density

Vishay Intertechnology XClampR® Bidirectional Flat Clamping TVS in DO-218AC Package Deliver Low Clamping Voltage, High Power Density

September 10, 2026

MacDermid Alpha Addresses Growing Demands for Electronics Reliability and Manufacturing Performance at Productronica India 2026

Renesas Launches New MCUs for Human Machine Interface and IoT Edge Systems

Renesas to Showcase Technologies Driving Future of AI — Software-Defined Vehicle and Intelligence at the Edge — at electronica India 202

Tech

Harwin Strengthens High-Reliability Offering with Acquisition of KEC

Harwin Strengthens High-Reliability Offering with Acquisition of KEC

September 10, 2026

VIAVI to Showcase Data Center Testing Portfolio at ECOC 2026

Analog Devices to Acquire Alif Semiconductor

Infineon extends collaboration with SolarEdge to enable solid-state protection for 800 VDC AI data centers

Entertainment

Microchip’s 1.2V Clock Buffers Link Latest SoCs and FPGAs with Higher Voltage Components

September 9, 2026

Arrow Electronics enables early evaluation of NXP’s Ara240 Edge AI Accelerator

Avnet Silica to Showcase Intelligent, Connected Systems from Device to Cloud at SIDO 2026

Physical AI Will Transform Robotics into Scalable Intelligent Machines: Allan Lagasca, STMicroelectronics

Lifestyle

Expanded Line-up of Automotive-Grade Metal Power Inductors

Expanded Line-up of Automotive-Grade Metal Power Inductors

September 9, 2026

ST25DA-C, 1st fully compliant Matter 1.6 device already at the center of NFC commissioning for many industry giants

Vishay Intertechnology 45 mm Inductive Position Sensor Encoder Enables Reliable Operation Near Electric Motors

TDK launches industry-leading low-resistance soft-termination X7R MLCCs with 10 μF/100 V in the 3225 format for AI servers, humanoids, and xEVs

Science

Fujitsu develops diamond-spin quantum computer prototype

Fujitsu develops diamond-spin quantum computer prototype

September 9, 2026

Crealights and GlobalFoundries Deepen Global Strategic Partnership

New Infineon OPTIREG™ TLE9744QK Power Management IC integrates power and safety for hybrid and electric vehicle traction inverters

SolarSense AI: Predictive Solar Panel Cleaning with ESP32

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