TDK expands micro POL power module portfolio for high-density AI edge systems
Ultra-compact micro POL module FS3303 delivers 3 A in a 2.5 × 2.5 mm footprint with only 1.2 mm height, ...
Read moreDetailsUltra-compact micro POL module FS3303 delivers 3 A in a 2.5 × 2.5 mm footprint with only 1.2 mm height, ...
Read moreDetailsHighlights include two SST solutions for converting the MV grid to 800V HV DC, a 10 kW, 800 V-to-50 V ...
Read moreDetailsRuggedized in an ultra-high vacuum for enhanced thermal insulation, the EX-423 delivers stability and RF performance National, 18th May 2026: Microchip ...
Read moreDetailsFeaturing a Low 0.88 mm Profile and Wettable Flanks, Unidirectional and Bidirectional Devices Save Space and Provide Excellent Clamping Capability ...
Read moreDetailsTDK Corporation (TSE: 6762) announces the launch of the TDK‑Lambda i9C series, a 1500 W non‑isolated DC‑DC buck‑boost power module ...
Read moreDetailsNext‑Generation 100/1000BASE‑T1 Single Pair Ethernet PHYs Integrate MACsec Security, Time Sensitive Networking and Functional Safety National, 13th May 2026: As ...
Read moreDetailsMunich, Germany – May 12, 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced a collaboration with d-Matrix®, ...
Read moreDetailsIdeaspring Capital leads the round, with participation from Singularity AMC, Avatar Growth Capital, and seed investor Persistent Systems Bengaluru, May 12, ...
Read moreDetailsVD55G4 and VD65G4 extend the ST BrightSense portfolio with compact, ultralow-power, microcontroller-compatible sensors for wearables, AR/VR, and smart devices These new global-shutter image ...
Read moreDetailsThe demand for advanced capabilities in entry-level microcontrollers continues to evolve as embedded systems become increasingly complex. The introduction of ...
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