Infineon advances GaN ease-of-use with integrated half-bridge solutions launching CoolGaN™ Drive HB 600 V G5
Munich, Germany – 26 February 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its CoolGaN™ portfolio with ...
Read moreMunich, Germany – 26 February 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its CoolGaN™ portfolio with ...
Read moreA diverse range of interactive displays will give attendees a real-world view of how emerging embedded technologies can be applied ...
Read moreDesign challenge encourages engineers to create innovative security projects and compete for prizes Bengaluru, India – 25 February 2026: element14, an Avnet ...
Read more25 February 2026 - Murata Manufacturing and Endeavor Bulgaria have announced three winning companies of the 2025 KUMIHIMO Tech Camp during a ...
Read moreRenesas ADAS automotive SoC, R-Car V4H has been selected for the TSS(LSS) control unit supplied by Denso for Toyota’s new ...
Read moreMunich, Germany – 24 February 2026 – Next-generation embedded systems are essential for applications in the rapidly evolving connected world. ...
Read moreNanoXplore’s NG-ULTRA FPGA becomes the first product qualified to new European ESCC 9030 standard for space applications The product leverages ...
Read moreScalability and functional safety enabled by chiplet technology Auto-grade quality for large, modern AI NPUs Advanced power control for higher ...
Read moreAchieves flexible, small-block configuration for large-scale TCAMs Cuts search energy and boosts speed through efficient search processing Enhanced functional safety ...
Read moreMulti‑billion-dollar collaboration strengthens supply chain resiliency and supports growing demand for chips powering smart vehicles and next-generation industrial systems MALTA, ...
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